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Heat sink(IGBT) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Jul 09, 2025～Aug 05, 2025
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Heat sink Product List

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Large freshly cut heat sink

Large freshly cut heat sink

Capable of handling high calorific values! Can be manufactured with a minimum pitch of 0.3mm and a maximum width of 3,000mm.

Zaward Co., Ltd. manufactures heat sinks using a method that "shaves" aluminum (A1060, A6063) and copper (C1100) with blades. We are capable of processing large products with narrow pitches and manufacturing up to a maximum width of 3,000mm. Our company also responds quickly to design development concerns, including design proposals based on thermal design. Please feel free to contact us when needed. 【Features】 ■ Capable of processing large products with narrow pitches 　→ Minimum pitch of 0.3mm is possible ■ Wide manufacturing capability 　→ Maximum width of 3,000mm is possible ■ Can accommodate high heat generation 　→ Compatible with high heat generating elements such as IGBTs *For more details, please refer to the PDF document or feel free to contact us.

  • Cooling system

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Water-Cooled Heat Sink Series

Water-Cooled Heat Sink Series

Flow path design to achieve uniform cooling

Water is circulated inside a metal plate to cool the entire plate, and a heating element is attached to absorb heat. This is primarily used for cooling semiconductor devices such as IGBTs, as well as for various applications and industries including UV-LEDs, amplifiers, and Peltier elements. The performance of water-cooled heat sinks varies significantly depending on the flow path structure and the machining precision of the element surface. Our company is committed to efficient and uniform cooling within the plane, and we design and manufacture water-cooled heat sinks that meet your desired performance and shape.

  • Other semiconductor manufacturing equipment
  • Cooling system

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Water-cooled heat sink for IGBT

Water-cooled heat sink for IGBT

Lightweight due to its thickness of 3 to 15 millimeters! You can choose from various types such as double-sided, single-sided, and ultra-thin.

IGBT power devices used for various applications. We introduce the "water-cooled heat sink" that maximizes their performance. Made of copper, which excels in performance and durability, it is lightweight due to its thickness of 3 to 15 millimeters. You can choose from various types such as double-sided mounting, single-sided mounting, and ultra-thin models. In addition to 8 standard products, custom manufacturing is available up to approximately 500×800 millimeters. The price is for one unit, and discounts are available for orders of 2 or more, 10 or more, and 50 or more. Please contact us for more details. 【Features】 ■ Made of oxygen-free copper with excellent thermal conductivity and durability ■ Lightweight due to its thickness of 3 to 15 millimeters ■ In addition to 8 standard products, various custom products can be manufactured according to your needs ■ Three types available (double-sided mounting/single-sided mounting/ultra-thin) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • Other electronic parts
  • Other environmental equipment

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Low thermal expansion, high thermal conductivity, heat sink.

Low thermal expansion, high thermal conductivity, heat sink.

The optimal heat sink requires a balance between thermal expansion rate and conductivity.

Thermal management in device design is an essential fundamental technology for various electronics products where high output and miniaturization are advancing. Ensuring the reliability of devices involves minimizing the thermal impact on semiconductor elements and being mindful of the thermal expansion of each material. When the thermal expansion coefficients of materials differ, significant stress can occur in the materials due to temperature changes, potentially leading to serious malfunctions. At Planzé, we provide ideal heat sinks with high thermal conductivity and appropriate thermal expansion coefficients to enhance device reliability and extend product lifespan.

  • Non-ferrous metals
  • Other semiconductors
  • diode

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Water-cooled heat sink

Water-cooled heat sink

Outstanding cooling effect!

Due to the increase in the capacity of components, air cooling methods are reaching their limits. Our oxygen-free copper water-cooled heat sinks, with a thickness of 6 to 20 mm, are about one-tenth the size of air cooling!! They provide several times the cooling effect per unit area and contribute to space-saving.

  • Other semiconductor manufacturing equipment

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WKBS Forced Air Cooling Dedicated Heat Sink

WKBS Forced Air Cooling Dedicated Heat Sink

WKBS Forced Air Cooling Dedicated Heat Sink

This is a dual-sided riveted type heat sink that applies the conventional single-sided riveting method (KBS) series. ● It is a high-performance heat sink specifically designed for forced air cooling, capable of both single-sided and dual-sided mounting. ● It features an optimal structural design for mounting various modules such as Tr, DI, and IGBT. ● Compared to conventional products, the upper and lower fins are fixed, eliminating the need for fin retaining plates, so no side mounting screws are required. ● It prevents fin vibration. ● Even in the single-sided mounting type, component mounting is possible on the backside.

  • others

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